PCB工艺芯片封装技术详解
PCB工艺芯片封装技术详解1、BGA(ball grid array)也叫CPAC。 球形触点排列,表面贴装封装之一。 在显示模式下,在印刷基板的背面做一个球形凸块来代替引脚,在印刷基板的正面组装LS...
PCB工艺芯片封装技术详解1、BGA(ball grid array)也叫CPAC。 球形触点排列,表面贴装封装之一。 在显示模式下,在印刷基板的背面做一个球形凸块来代替引脚,在印刷基板的正面组装LS...
The circuit board manufacturer and circuit board designer will explain the waste circuit board treat...
一、PCB VS FPCPCB是电子工业中重要的电子元器件之一。 几乎每一种电子设备,如电子表、计算器、计算机、通讯电子设备、军用武器系统等,只要有集成电路等电子元器件,都需要用印制板进行电气互连。 ...
Understand PCB design, PCB layout and PCB manufacturing in PCB related industries, and PCB design sk...
Understand PCB design, circuit board and PCB components in PCB related industries, and PCB design ef...
Circuit board manufacturers and circuit board designers explain electroplating process learning data...
Understand PCB design, PCB layout and PCB manufacturing in PCB related industries, and Let's take a ...
Understand PCB design, PCB layout and PCB manufacturing in PCB related industries, and Let's talk ab...
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